Poly(acrylic acid) as an adhesion promoter for UV-assisted thermoplastic bonding: Application for the in vitro construction of human blood vessels

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초록

In this study, we introduced a novel adhesion bonding method for fabricating thermoplastic microdevices using poly(acrylic acid) (PAA) as a UV-assisted adhesion promoter. The bonding mechanism was based on the covalent cross-links between poly(methyl methacrylate) (PMMA) and PAA via the free radicals in their carbon backbone generated under UV irradiation. The water contact angle and Fourier-transformed infrared (FTIR) analysis were performed to analyze the surface characteristics of the PAA-coated PMMA. PMMAs were bonded under UV treatment for 60 s with the highest bond strength of around 1.18 MPa. The PMMA microdevice was leak-proof for over 200 h. Besides, clog-free PMMA microdevices with various-sizes microchannels were performed to demonstrate such a high applicable bonding method for microdevice fabrication. Moreover, PMMAs were bonded with other thermoplastics with a bond strength of around 0.5 MPa. Notably, collagen was easily coated inside the PMMA microchannels via electrostatic interaction between PAA and collagen which is beneficial for on-device cell culture. As a result, a layered co-culture model of smooth muscle cells (SMCs) and human umbilical vein endothelial cells (HUVECs) was realized inside simple straight microchannels mimicking human blood vessel wall. Therefore, the introduced bonding method could pave the way for fabricating microdevice for cell-related applications. © 2021 Elsevier B.V.

키워드

Adhesion bonding; Human umbilical vein endothelial cells (HUVECs); In vitro human blood vessels; Poly(acrylic acid) (PAA); Poly(methyl methacrylate) (PMMA); Smooth muscle cells (SMCs)
제목
Poly(acrylic acid) as an adhesion promoter for UV-assisted thermoplastic bonding: Application for the in vitro construction of human blood vessels
저자
Le, N.X.T.; Trinh, K.T.L.; Lee, Nae Yoon
DOI
10.1016/j.msec.2021.111874
발행일
2021-03
유형
Article
저널명
Materials Science and Engineering: C
권
122