HMDS 표면 처리를 통한 유리 기판 상 Mo/Cu 이중 금속층의 습식 식각 및 패터닝 프로파일 최적화

초록

In this study, the deposition and patterning processes of molybdenum (Mo) and copper (Cu) dual layers on glass substrates were investigated for highly reliable electrode wiring. The Mo/Cu films were continuously deposited using an in-line DC magnetron sputtering system without a vacuum break. The deposition pressure was optimized to 5 mTorr for Mo and 3 mTorr for Cu, and thickness was precisely controlled by scan counts. Cross-sectional focused ion beam scanning electron microscopy (FIB-SEM) revealed a highly uniform Mo/Cu interface. X-ray diffraction (XRD) analysis confirmed excellent crystallinity, exhibiting strong Mo (110) and Cu (111) preferred orientations. The in-situ deposition promoted a highly oriented Cu{111}//Mo{110} interfacial texture, significantly reducing interfacial energy and enhancing structural stability. Furthermore, the wet etching process using a persulfate-based etchant was optimized after HMDS treatment and photoresist patterning, resulting in well-defined micro-patterns without severe undercut or residues. These results demonstrate that the optimized Mo/Cu deposition and etching processes have high potential for immediate application in large-scale mass production.

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