Cornea

ISSN
P 0277-3740 E 1536-4798
출판사
Lippincott Williams & Wilkins Ltd.
국가
USA
발행 상태
활성

데이터베이스 수록 정보

EMBASE 2016-2020 (5년)
JCR 1997-2019 (23년)
MEDLINE 2016-2021 (6년)
SCI 2010-2019 (10년)
SCIE 2010-2021 (12년)
Scopus 2017-2020 (4년)
SJR 1999-2019 (21년)

전체 8건 중 1번부터 8번까지의 결과를 표시합니다.

2024
Article

Organic Ternary Logic Inverter Using Negative Transconductance Pull-Down Switching Transistor

  • Kim, Somi
  • Jeon, Yunchae
  • Cho, Hong-Rae
  • Kim, Chang-Hyun
  • Yoo, Hocheon
  • 2024-04
  • IEEE Electron Device Letters
  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Article

Significant Reduction of 1/f Noise in Organic Thin-Film Transistors With Self-Assembled Monolayer: Considerations of Density-of-States

  • Shin, Wonjun
  • Bae, Jisuk
  • Park, Joon Hyung
  • Lee, Jong-Ho
  • Kim, Chang-Hyun
  • 외 1명
  • 2024-04
  • IEEE Electron Device Letters
  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
2023
Article

Electrically Erasable Wide-Bandgap Charge-Trap Memory With an Electric-Flux-Modulating Counter Electrode

  • 2023-11
  • IEEE Electron Device Letters
  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Article

Pre-State-Dependent Ternary/Binary Logic Operation Obtained by Inkjet Printed Indium Oxide and Single-Walled Carbon Nanotube/Indium Oxide Heterojunction-Based Transistors

  • 2023-02
  • IEEE Electron Device Letters
  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
2022
Article

A Complementary Logic-in-Memory Inverter From Organic-Inorganic Hybrid Transistors

  • 2022-11
  • IEEE Electron Device Letters
  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
2021
Article

Unified Compact Model for Thin-Film Heterojunction Anti-Ambipolar Transistors

  • 2021-09
  • IEEE Electron Device Letters
  • Institute of Electrical and Electronics Engineers Inc.
Article

Approaching the Nernst Detection Limit in an Electrolyte-Gated Metal Oxide Transistor

  • 2021-01
  • IEEE Electron Device Letters
  • Institute of Electrical and Electronics Engineers Inc.
2020
Article

Multi-Stage Organic Logic Circuits Using Via-Hole-Less Metal Interconnects

  • Park, H.
  • Yoo, H.
  • Lee, C.
  • Kim, J.-J.
  • Im, S.G.
  • 2020-11
  • IEEE Electron Device Letters
  • Institute of Electrical and Electronics Engineers Inc.